- Low-kV ultra-high-resolution imaging of high-end semiconductor devices
- Precise end-pointing at low electron beam energies
- Gentle FIB thinning for improved quality results in TEM sample preparation enabled by excellent low-kV ion beam performance
- Optimized workflows and recipes for easy preparation of ultra-thin TEM lamellae
- Semi-automated software module for site-specific TEM lamella preparation
- Preparation of advanced geometry TEM lamellae from the most advanced semiconductor nodes
- Specialized, load-lock-compatible stage carousel for TEM sample preparation
- Dedicated TEM grid holders with fully optimized geometry for advanced TEM sample preparation
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Multiple-site TEM sample preparation
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Inverted lamella geometry
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HR-TEM image of a “gate-cut” TEM lamella prepared from a 10 nm technology node
