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A Plasma FIB-SEM platform for deep sectioning and the highest resolution end-pointing for package level failure analysis

  • Curtaining-free large-area cross-sectioning for physical failure analysis of advanced packaging technologies
  • Prepare large area FIB-cross-sections up to 1 mm wide
  • Obtain low noise, high-resolution image at low keVs in short acquisition time at FIB-SEM coincidence with the sample tilted
  • Live SEM-monitoring during FIB milling for precise end-pointing

  • Observe the most beam-sensitive materials using low keVs ultra-high resolution for surface sensitivity and high material contrast
  • Effective techniques and recipes for fast and artefact-free cross-sectioning of composite samples (OLED and TFT displays, MEMS devices, isolation dielectrics) at high currents
  • Essence™ easy-to-use modular user interface

Webinar Recording

TESCAN SOLARIS X for Semiconductors


The link above will get you to our webinar recording at GoToWebinar platform.