- Curtaining-free large-area cross-sectioning for physical failure analysis of advanced packaging technologies
- Prepare large area FIB-cross-sections up to 1 mm wide
- Obtain low noise, high-resolution image at low keVs in short acquisition time at FIB-SEM coincidence with the sample tilted
- Live SEM-monitoring during FIB milling for precise end-pointing
- Observe the most beam-sensitive materials using low keVs ultra-high resolution for surface sensitivity and high material contrast
- Effective techniques and recipes for fast and artefact-free cross-sectioning of composite samples (OLED and TFT displays, MEMS devices, isolation dielectrics) at high currents
- Essence™ easy-to-use modular user interface
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Cross-section of a TSV array
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Cross-section of a sensor MEMS device
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STEM-BF image of an 80 nm thick TEM lamella from a 65 nm DRAM node
